How to apply:

The job is no longer available.

Please check out the link to apply for the internship : https://intel.taleo.net/careersection/10000/jobdetail.ftl?job=356543&src=JB-10400

Important dates:

• Posting Date:  Nov 24, 2009
• Apply Before: Nov 25, 2010

Location:

Bangalore

Internship-Design Engineering:

Intern Responsibilities:

• Component Design Engineers are responsible for the design and development of electronic and/or IC components.
• Responsible for the logic design, logic verification, device evaluation and characterization, documentation of specifications, modification and evaluation of semiconductor devices and components, improving and/or automating design and verification methodologies, planning and organizing design projects or phases of design projects
• Responding to customer and/or client requests or events as they occur
• Developing solutions to problems utilizing formal education and judgment
• Working as an effective member of the development team
• Communicating progress status, technical details and issues clearly

Desired candidate profile:

• You should possess a Master’s degree in Electrical and/or Electronics Engineering with a good knowledge of logic design and a basic understanding of validation and structural design.

Company profile:

Intel-Employees in Intel’s Mobile Platforms group design and implement the Intel? Mobile Technology used in notebook computers, phones, ultra-mobile PCs and other portable devices. Intel’s industry leading technology includes processors, chipsets, Enhanced Data for GSM Environment (EDGE), Universal Mobile Telecommunications System (UMTS), High-Speed Downlink Packet Access (HSDPA), Wi-Fi and WiMAX wireless radios. These industry-leading technologies are driving the new mobile era of semiconductors, where people will carry their computing with them, making it truly personal. This group is growing very quickly and has the broadest set of mobile and wireless technologies in the industry.